Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders

Warrendale, Pa / TMS (2013) [Journal Article]

Journal of electronic materials
Volume: 42
Issue: 8
Page(s): 2658-2666

Authors

Authors

Schmitz, G. J.
Zhou, B.
Böttger, B.
Klima, S.
Villain, J.

Identifier