Phase-Field Modeling and Experimental Observation of Microstructures in Solidifying Sn-Ag-Cu Solders

Schmitz, G. J. (Corresponding author); Zhou, B.; Böttger, B.; Klima, S.; Villain, J.

Warrendale, Pa : TMS (2013)
Journal Article

In: Journal of electronic materials
Volume: 42
Issue: 8
Page(s)/Article-Nr.: 2658-2666

Identifier